What is the Difference between MCPCBs and FR4 PCBs

What is the Difference between MCPCBs and FR4 PCBs


Instead of using any plated through holes, a key point to incorporate into MCPCB design is only using surface mounted components. Because of that the layer structure is a thick piece of metal, plated through holes (or non-plated holes with conductive components inserted into it) may cause short circuits.To get more news about fr4 circuit board, you can visit pcbmake official website.

To transmit heat, most LED PCBs built on multi-layered FR4 substrates must use a pattern of closely-spaced through vias under each component. If these are not filled, solder will migrate these vias during assembly, causing imperfect solder joints.

The work of the vias will be done by the material of MCPCBs. The entire bottom side is made of a metal with a higher thermal conductivity, so the cooling effect can be enhanced without heat dissipation holes. As a result, most MCPCBs require minimal drilling, just very few large mounting holes.Conductivity: MCPCB has higher thermal conductivity, ranging from 1.0W-4.0W, most commonly around 2.0W, while FR4 has low thermal conductivity, typically around 0.3W.

Plated Through Holes: In MCPCBs, plated through holes are not available for 1-layer PCB. All components are surface-mounted. FR4 PCB typically uses plated through holes.

Thermal Relief: Thermal relief in FR4 PCB typically involves vias for heat transfer. Longer drill cycle, adds many processes. MCPCB materials provide their own thermal relief. Via drilling, deposition, and plating processes are eliminated.

Solder Mask: MCPCB solder mask are almost exclusively white for LED boards which applied to top only. While FR4 PCB solder mask is typically dark colors (green, red, blue, black.) which usually applied top and bottom.Thickness: FR4 PCB has a wide range of thicknesses available using various material combinations and layer counts. MCPCB thickness variation is limited by available backing plate thicknesses and dielectric sheet thicknesses.

Machining Process: FR4 PCB uses standard machining practices (drilling, routing, v-scoring, countersink, counterbore) while MCPCB uses the same machining as FR4, except that v-score must use diamond coated saw blades for the added strain from cutting into metal.

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